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Sputtering Targets

Thin Films

Sputtering is a process where energetic ions eject atoms from a solid target material. This process is used commonly for thin film deposition. The two largest industries which utilize sputtering technology are the semiconductor industry in the production of computer memory chips and the optical coatings industry for the production of antireflective coatings.

In addition to tantalum, Admat also supplies sputtering targets in niobium, titanium, tungsten, molybdenum, hafnium, silicon and some of their oxides. All our products are engineered specifically to perform reliably in thin film depositions. Our manufacturing process ensures the target’s grain and texture are free from banding. We offer a wide selection of purities and shapes.

Available Target Materials

Material Symbol Best Purity, wt%
Chromium Cr 99.95
Hafnium Hf 99.95 with Zr 0.5 max
Indium Tin Oxide (ITO) In2O3-SnO2 99.99
Molybdenum Mo 99.99
Niobium Nb 99.98
Niobium oxide (pentoxide) Nb2O5 99.99
Niobium Titanium alloys NbTi 99.95
Material Symbol Best Purity, wt%
Silicon Si 99.999
Tantalum Ta 99.999
Tantalum oxide (pentoxide) Ta2O5 99.99
Niobium Alloys NbTi, NbNi 99.95
Tantalum Alloys TaW, TaNb 99.99
Titanium Ti 99.5
Tungsten W 99.99

Oxide | Description | Purity | Density | Notes

AZO | Aluminum zinc oxide 2% Al2O3 | 98% ZnO | 99.99 | 98 | 5×10-4 ohm-cm

ITO | Indium tin oxide, In2O3-SnO2 | 99.99 | 99 | 2×10-4 ohm-cm

NB2O5 | Niobium pentoxide, NB2O5 | 99.99 | 99 | < 0.01 ohm-cm

Ta2O5 | Tantalum pentoxide, Ta2O5 | 99.99 | 99

ZNO | Zinc Oxide | 99.99 | 98