Sputtering is a process where energetic ions eject atoms from a solid target material. This process is used commonly for thin film deposition. The two largest industries which utilize
sputtering technology are the semiconductor industry in the production of computer memory chips and the optical coatings industry for the production of antireflective coatings.
Admat supplies sputtering targets in tantalum, niobium, titanium, tungsten, molybdenum, and silicon. All our products are engineered specifically to perform reliably in thin film applications. Our manufacturing process ensures the target’s grain and texture are free from banding. We offer a wide selection of purities and shapes.
| Available Target Materials |
| Metal |
Element |
Best Purity |
| Molybdenum |
Mo |
99.99 |
| Niobium |
Nb |
99.99 |
| Niobium Alloys |
NbTi, NbNi |
99.95 |
| Silicon |
Si |
99.999 |
| Tantalum |
Ta |
99.999 |
| Tantalum Alloys |
TaW, TaNb |
99.99 |
| Titanium |
Ti |
99.5 |
| Tungsten |
W |
99.99 |
| Available Oxide Sputtering Targets |
| Oxide |
Description |
Purity |
Relative Density |
Notes |
| AZO |
Aluminum zinc oxide |
99.99 |
98 |
5×10-4 ohm-cm |
|
2% Al2O3 – 98% ZnO |
|
|
|
| ITO |
Indium tin oxide |
99.99 |
99 |
2×10-4 ohm-cm |
|
In2O3-SnO2 |
|
|
|
| NB2O5 |
Niobium pentoxide |
99.99 |
99 |
<0.01 ohm-cm |
|
NB2O5 |
|
|
|
| Ta2O5 |
Tantalum pentoxide |
99.99 |
99 |
|
|
Ta2O5 |
|
|
|
| ZNO |
Zinc Oxide |
99.99 |
98 |
|
|
ZnO |
|
|