Sputtering Targets

Sputtering is a process where energetic ions eject atoms from a solid target material. This process is used commonly for thin film deposition. The two largest industries which utilize sputtering technology are the semiconductor industry in the production of computer memory chips and the optical coatings industry for the production of antireflective coatings.

Admat supplies sputtering targets in tantalum, niobium, titanium, tungsten, molybdenum, and silicon. All our products are engineered specifically to perform reliably in thin film applications. Our manufacturing process ensures the target’s grain and texture are free from banding. We offer a wide selection of purities and shapes.

Available Target Materials
Metal Element Best Purity
Molybdenum Mo 99.99
Niobium Nb 99.99
Niobium Alloys NbTi, NbNi 99.95
Silicon Si 99.999
Tantalum Ta 99.999
Tantalum Alloys TaW, TaNb 99.99
Titanium Ti 99.5
Tungsten W 99.99
Available Oxide Sputtering Targets
Oxide Description Purity Relative Density Notes
AZO Aluminum zinc oxide 99.99 98 5×10-4 ohm-cm
2% Al2O3 – 98% ZnO
ITO Indium tin oxide 99.99 99 2×10-4 ohm-cm
In2O3-SnO2
NB2O5 Niobium pentoxide 99.99 99 <0.01 ohm-cm
NB2O5
Ta2O5 Tantalum pentoxide 99.99 99
Ta2O5
ZNO Zinc Oxide 99.99 98
ZnO

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